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Comsol 5.1 product suite
Comsol 5.1 product suite











comsol 5.1 product suite

Additionally, increased automated swept meshing capabilities allow for faster modeling.

comsol 5.1 product suite

System tool makes it easier to define anisotropic materials in curved geometric shapes. Geometry and Mesh – A new feature allows users to make quick what-if studies by taking a 2D geometry from the cross-section of a 3D geometry. COMSOL Multiphysics 4.3b brings tremendous enhancements to features inĮxisting modules, thus augmenting simulation speed and the capabilities of the entire product suite. Tools that offer increased usability and performance throughout the product development process. The new features delivered with the COMSOL product suite include enhancements to CAD importing and geometry handling, meshing, physics, solvers, results, and productivity Sensors, chlor-alkali electrolysis, desalination of seawater, waste water treatment, and control of electrochemical reactions in biomedical implants. Typical applications include: glucose sensors, gas Electrochemistry Module – Tailored user interfaces are now available for electroanalysis, electrolysis, and electrodialysis. Transistors, MOSFETs, MESFETs, thyristors, and Schottky diodes. Semiconductor Module – Enables the detailed analysis of semiconductor device operations at the fundamental physics level allowing for the modeling of PN junctions, bipolar Spectrometers, semiconductor processing, satellite technology, particle accelerators, shale gas exploration, and flow in nanoporous materials.

comsol 5.1 product suite

Molecular Flow Module – Offers the capability to simulate rarefied gas flow in complex CAD geometries of vacuum systems. Plasmonic devices, metamaterials, laser beam propagation, and non-linear optical components. Wave Optics Module – Allows users to analyze electromagnetic wave propagation in optically large structures, such as optical fibers and sensors, bidirectional couplers, Transitional and rotational displacements, as well as locking,Ĭan be simulated for a variety of joint types, including prismatic, hinge, cylindrical, screw, planar, ball, slot, and reduced slot joints. Multibody Dynamics Module – Provides users with the ability to analyze the assembly of rigid and flexible bodies. With the introduction of the five new modules, users in key application areas from major industries now have access to the new modeling and simulation tools offered by













Comsol 5.1 product suite